Warpage and Thermal Characterization of Fan-Out Wafer-Level PackagingJohn H. Lau, Qingxiang Yong, K. H. Tan et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2017Cited by 160
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level PackagingJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2018Cited by 96
Fan-Out Wafer-Level Packaging for Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2018Cited by 87
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)John H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2017Cited by 40
Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2018Cited by 25