Thermomechanical properties of 1C molding compounds
H. E. Bair(AT&T (United States)), D. L. Crouthamel(AT&T (United States)), Carl R. Taylor(AT&T (United States)), S. C. Tighe(AT&T (United States)), Jason T. Ryan(AT&T (United States)), D. J. Boyle(AT&T (United States))
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