The impact of moisture in mold compound preforms on the warpage of PBGA packages

T.Y. Lin, Yi Ma(Agency for Science, Technology and Research), K.H. Chua, B. Njoman, D. L. Crouthamel(AT&T (United States)), S.Y. Teo

Microelectronics Reliability

December 9, 2003

10.1016/j.microrel.2003.08.003

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