Understanding effect of additives in copper electroplating filling for through silicon viaMin Miao, Yufeng Jin, Jing Chen et al.|Unknown|2012Cited by 2
Process development of a stacked chip module with TSV interconnectionXiaoxia Zhong, Yufeng Jin, Shenglin Ma et al.|Unknown|2012Cited by 1
Development of a through-stack-via integrated SRAM moduleYunhui Zhu, Yufeng Jin, Xin Sun et al.|Unknown|2012Cited by 0
A TSV last integration approach with wafer level pre-patterned adhesive bondingYunhui Zhu, Yufeng Jin, Shenglin Ma et al.|2012 4th Electronic System-Integration Technology Conference|2012Cited by 0