A TSV last integration approach with wafer level pre-patterned adhesive bonding
Yunhui Zhu(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Xiaoxia Zhong(Shanghai Jiao Tong University), Yuan Bian(Peking University), Shenglin Ma(Xiamen University), Qinghu Cui(Peking University Shenzhen Hospital), Min Miao(Information Technology Institute), Xin Sun(Peking University), Jing Chen(Shanghai Jiao Tong University)
2012 4th Electronic System-Integration Technology Conference
September 1, 2012
Cited by 0
Related Papers
Discovery of Multitarget Inhibitors by Combining Molecular Docking with Common Pharmacophore Matching
|Journal of Medicinal Chemistry|2008|137
Pocket v.2: Further Developments on Receptor-Based Pharmacophore Modeling
|Journal of Chemical Information and Modeling|2006|130
The effect of voice cuing on releasing Chinese speech from informational masking
|Speech Communication|2007|78
Phase diagram and thermal properties of strong-interaction matter
|Physical review. D/Physical review. D.|2016|71
The effect of perceived spatial separation on informational masking of Chinese speech
|Hearing Research|2004|71