Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF DevicesJun Yan, Zhongjun Tang, Shuwei He et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2018Cited by 36
A RF Redundant TSV Interconnection for High Resistance Si InterposerMengcheng Wang, Shuwei He, Shenglin Ma et al.|Micromachines|2021Cited by 21
Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF DevicesHan Cai, Shuwei He, Shenglin Ma et al.|Unknown|2018Cited by 20
Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF ApplicationsYunheng Sun, Shuwei He, Han Cai et al.|Unknown|2018Cited by 7
Non-planar surface bonding with spray-coated SU-8 as adhesive layerNannan Li, Jing Chen, Shuwei He et al.|Micro & Nano Letters|2012Cited by 2