Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Jun Yan(Xiamen University), Zhongjun Tang, Lilin Hu, Yanming Xia(Xiamen University), Wei Wang(Qinghai University), Jing Chen(Shanghai Jiao Tong University), Jiwei Li(Xiamen University), Shenglin Ma(Xiamen University), Han Cai, Shuwei He(Chengdu Institute of Information Technology (China)), Yufeng Jin(Peking University Shenzhen Hospital), Rongfeng Luo(Xiamen University)
IEEE Transactions on Components Packaging and Manufacturing Technology
June 14, 2018
Cited by 36


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