Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications
Yunheng Sun(Peking University Shenzhen Hospital), Shuwei He(Chengdu Institute of Information Technology (China)), Jing Chen(Shanghai Jiao Tong University), Jiwei Li(Central South University), Shenglin Ma(Xiamen University), Han Cai, Yufeng Jin(Peking University Shenzhen Hospital), Liulin Hu, Wei Wang(Guangxi University), Min Miao(Information Technology Institute)
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