Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices
Han Cai, Shuwei He(Chengdu Institute of Information Technology (China)), Jing Chen(Shanghai Jiao Tong University), J. Andrew Zhang(Harbin Engineering University), Shenglin Ma(Xiamen University), Yufeng Jin(Peking University), Weiwei Xiang, Liulin Hu, Wei Wang(University at Albany, State University of New York)
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