A RF Redundant TSV Interconnection for High Resistance Si Interposer
Mengcheng Wang(Xiamen University), Shuwei He(Chengdu Institute of Information Technology (China)), Wei Wang(Qinghai University), Yufeng Jin(Peking University Shenzhen Hospital), Liulin Hu, Shenglin Ma(Xiamen University), Jing Chen(Shanghai Jiao Tong University)
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