Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in MicrochipsPedro F. C. Videira, Lucas F. M. da Silva, Bala Karunamurthy et al.|Polymers|2025Cited by 10
Effects of Temperature on the Fracture Response of EMC-Si Interface Found in Multilayer Semiconductor ComponentsJoão Valdoleiros, Lucas F. M. da Silva, Alireza Akhavan‐Safar et al.|Surfaces|2025Cited by 5
Thermal and residual stresses at the EMC-silicon interface: From wafer manufacturing to fracture testPedro F. C. Videira, Lucas F. M. da Silva, Bala Karunamurthy et al.|Materials Today Communications|2025Cited by 5
Mechanical Characterization of a Novel Cyclic Olefin-Based Hot-Melt AdhesiveV. C. Rodrigues, Lucas F. M. da Silva|Materials|2025Cited by 3
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive jointsV. Gutiérrez-Posada, Lucas F. M. da Silva|Journal of Materials Science Materials in Electronics|2024Cited by 1