Mechanical Characterization of a Novel Cyclic Olefin-Based Hot-Melt AdhesiveV. C. Rodrigues, Lucas F. M. da Silva|Materials|2025Cited by 3
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive jointsV. Gutiérrez-Posada, Lucas F. M. da Silva|Journal of Materials Science Materials in Electronics|2024Cited by 1