Thermal and residual stresses at the EMC-silicon interface: From wafer manufacturing to fracture test

Pedro F. C. Videira(Universidade do Porto), Lucas F. M. da Silva(Universidade do Porto), Alireza Akhavan‐Safar(Institute of Mechanical Engineering and Industrial Mangement), Ricardo J. C. Carbas(National Institute of Statistics and Geography), Payam Maleki(Institute of Mechanical Engineering and Industrial Mangement), Bala Karunamurthy(Siemens (Austria)), Eduardo A. S. Marques(Universidade do Porto)
Materials Today Communications
March 13, 2025
10.1016/j.mtcomm.2025.112218
Cited by 5

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