Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive jointsV. Gutiérrez-Posada(Universidad de León), Lucas F. M. da Silva(Universidade do Porto)Journal of Materials Science Materials in ElectronicsDecember 27, 202410.1007/s10854-024-14086-yCited by 1SaveCiteExport RISWatch citationsRelated PapersMechanical Characterization of a Novel Cyclic Olefin-Based Hot-Melt Adhesive|Materials|2025|3