Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips
Pedro F. C. Videira(Universidade do Porto), Lucas F. M. da Silva(Universidade do Porto), Alireza Akhavan‐Safar(Institute of Mechanical Engineering and Industrial Mangement), Ricardo J. C. Carbas(National Institute of Statistics and Geography), Bala Karunamurthy(Siemens (Austria)), Renato A. Ferreira(Universidade do Porto), Payam Maleki(Institute of Mechanical Engineering and Industrial Mangement), Eduardo A. S. Marques(Universidade do Porto)
Cited by 10
Related Papers
Effects of Temperature on the Fracture Response of EMC-Si Interface Found in Multilayer Semiconductor Components
|Surfaces|2025|5
Thermal and residual stresses at the EMC-silicon interface: From wafer manufacturing to fracture test
|Materials Today Communications|2025|5
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints
|Journal of Materials Science Materials in Electronics|2024|1