Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packagingJie Wu, Liujue Wang, Yilong Han et al.|Journal of Materials Science Materials in Electronics|2016Cited by 50
Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packagingJie Wu, Shuang Liu, Jingwen Wang et al.|Journal of Materials Science Materials in Electronics|2017Cited by 38
Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder JointsJie Wu, Peng Xue, Songbai Xue et al.|Journal of Electronic Materials|2019Cited by 17
Effect of in-situ formed Pr-coated Al2O3 nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal agingJie Wu, Mingfang Wu, Songbai Xue et al.|Journal of Alloys and Compounds|2019Cited by 10
Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy ResinPeng Zhang, Jianhao Wang, Songbai Xue et al.|Polymers|2022Cited by 10