Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging
Jie Wu(University of Nottingham Ningbo China), Shuang Liu(Nanjing University of Aeronautics and Astronautics), Songbai Xue(Nanjing University of Aeronautics and Astronautics), Jianxin Wang(Jiangsu University of Science and Technology), Jingwen Wang(Nanjing University of Aeronautics and Astronautics)
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