J

Jie Wu

Nanjing University of Posts and Telecommunications

ORCID: 0009-0000-4587-1801

Publishes on Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aluminum Alloys Composites Properties. 71 papers and 720 citations.

PubIndex Score13Top 87% · seniorHow it's scored
71Publications
720Total Citations
First publication: 2001First senior author: 2001