Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints
Jie Wu(University of Nottingham Ningbo China), Peng Xue(Nanjing University of Science and Technology), Songbai Xue(Nanjing University of Aeronautics and Astronautics), Jingwen Wang(Nanjing University of Aeronautics and Astronautics)
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