Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin
Peng Zhang(Nanjing University of Aeronautics and Astronautics), Jianhao Wang(The University of Osaka), Qingcheng Luo(Nanjing University of Aeronautics and Astronautics), Songbai Xue(Nanjing University of Aeronautics and Astronautics), Lu Liu(Nanjing University of Aeronautics and Astronautics), Jie Wu(University of Nottingham Ningbo China)
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