Review of reliability issues in high-k/metal gate stacksR. Degraeve, G. Groeseneken, T. Kauerauf et al.|Unknown|2008Cited by 65
A New TDDB Reliability Prediction Methodology Accounting for Multiple SBD and Wear OutS. Sahhaf, G. Groeseneken, B. Kaczer et al.|IEEE Transactions on Electron Devices|2009Cited by 33
Methodologies for sub-1nm EOT TDDB evaluationT. Kauerauf, Robert O’Connor, R. Degraeve et al.|Unknown|2011Cited by 27
TDDB Reliability Prediction Based on the Statistical Analysis of Hard Breakdown Including Multiple Soft Breakdown and Wear-outS. Sahhaf, G. Groeseneken, R. Degraeve et al.|Unknown|2007Cited by 22
A consistent model for the hard breakdown distribution including digital soft breakdown: the noble art of area scalingPh. Roussel, G. Groeseneken, R. Degraeve et al.|Microelectronic Engineering|2007Cited by 19