Effect of Joule heating on the reliability of microbumps in 3D ICYifan Yao, Yingxia Liu, Yang Wang et al.|Journal of Materials Research and Technology|2024Cited by 23
Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technologyYifan Yao, K. N. Tu, Andriy Gusak et al.|Scripta Materialia|2024Cited by 18
Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder JointsYifan Yao, Yingxia Liu, Zhenyun Lu et al.|Electronic Materials Letters|2024Cited by 7