Leaderboards/Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies

Last updated July 7, 2026

Rising Stars

New and hot

Rising Stars Papers

1

Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations

Journal of Manufacturing Processes|2024

98 cit.

2

Predictive Placement of IC Chips using ANN-GA Approach for Efficient Thermal Cooling

Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024

44 cit.

3

A Comprehensive Study on <i>Calophyllum inophyllum</i> Biodiesel and Dimethyl Carbonate Blends: Performance Optimization and Emission Control in Diesel Engines

Journal of Mines Metals and Fuels|2024

43 cit.

4

Performance of Solar Collector Using Recycled Aluminum Cans for Drying

Journal of Mines Metals and Fuels|2024

39 cit.

5

Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition

Corrosion Science|2024

35 cit.

6

Optimizing Aerofoil Design: A Comprehensive Analysis of Aerodynamic Efficiency through CFD Simulations and Wind Tunnel Experiments

Journal of Mines Metals and Fuels|2024

35 cit.

7

Numerical Investigation on the Influence of Substrate Board Thermal Conductivity on Electronic Component Temperature Regulation

Journal of Advanced Research in Numerical Heat Transfer|2024

35 cit.

8

The Impact of Circular Holes in Twisted Tape Inserts on Forced Convection Heat Transfer

Journal of Mines Metals and Fuels|2024

34 cit.

9

Experimental Investigation of Heat Transfer from Symmetric and Asymmetric IC Chips Mounted on the SMPS Board with and without PCM

Journal of Advanced Research in Fluid Mechanics and Thermal Sciences|2024

33 cit.

10

Predicting Heat Transfer Enhancement with Twisted Tape Inserts Using Fuzzy Logic Techniques in Heat Exchangers

Journal of Mines Metals and Fuels|2024

31 cit.

Emerging Leaders

Gaining momentum

Emerging Leaders Papers

1

Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method

Engineering Fracture Mechanics|2023

212 cit.

2

Machine learning method to predict dynamic compressive response of concrete-like material at high strain rates

Defence Technology|2022

164 cit.

3

Plastic damage prediction of concrete under compression based on deep learning

Acta Mechanica|2023

152 cit.

4

Determination of gradient residual stress for elastoplastic materials by nanoindentation

Journal of Manufacturing Processes|2023

151 cit.

5

An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures

International Journal of Impact Engineering|2023

142 cit.

6

Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method

International Journal of Fatigue|2023

141 cit.

7

In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Journal of Material Science and Technology|2023

138 cit.

8

Challenges and recent prospectives of 3D heterogeneous integration

e-Prime - Advances in Electrical Engineering Electronics and Energy|2022

133 cit.

9

Machine learning framework for predicting the low cycle fatigue life of lead-free solders

Engineering Failure Analysis|2023

127 cit.

10

Unveiling the damage evolution of SAC305 during fatigue by entropy generation

International Journal of Mechanical Sciences|2022

125 cit.

Current Senior Leaders

Established & currently active

Current Senior Leaders Papers

1

Deep Residual Shrinkage Networks for Fault Diagnosis

IEEE Transactions on Industrial Informatics|2019

1.4k cit.

2

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Materials Science and Engineering R Reports|2002

1.4k cit.

3

Long Short-Term Memory Recurrent Neural Network for Remaining Useful Life Prediction of Lithium-Ion Batteries

IEEE Transactions on Vehicular Technology|2018

1.3k cit.

4

Battery Lifetime Prognostics

Joule|2020

1.2k cit.

5

Interfacial reactions between lead-free solders and common base materials

Materials Science and Engineering R Reports|2005

1.1k cit.

6

Recent advances on electromigration in very-large-scale-integration of interconnects

Journal of Applied Physics|2003

1.1k cit.

7

Prognostics of lithium-ion batteries based on Dempster–Shafer theory and the Bayesian Monte Carlo method

Journal of Power Sources|2011

1k cit.

8

Light emitting diodes reliability review

Microelectronics Reliability|2011

750 cit.

9

Advances in lead-free electronics soldering

Current Opinion in Solid State and Materials Science|2001

725 cit.

10

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Materials Science and Engineering R Reports|2006

706 cit.

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