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Yifan Yao

City University of Hong Kong

ORCID: 0000-0001-7510-7492

Publishes on Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Copper Interconnects and Reliability. 58 papers and 559 citations.

PubIndex Score68Top 32% · mid-careerHow it's scored

58Publications

559Total Citations

First publication: 1974First senior author: 2025

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability Polymer Nanocomposites and Properties Advanced Memory and Neural Computing

Top publicationsby citations

TDI charge-coupled devices: Design and applications

H.‐S. Philip Wong, E.S. Schlig, Yifan Yao|IBM Journal of Research and Development|1992

Cited by 91

Electromigration in three-dimensional integrated circuits

Zesheng Shen, Yingxia Liu, Siyi Jing et al.|Applied Physics Reviews|2023

Cited by 67

Thermally Resistant, Mechanically Robust, Enamel‐Inspired Hydroxyapatite/Polyethylene Nanocomposite Battery Separator

Honglei Yue, Ke Chen, Yifan Yao et al.|Advanced Functional Materials|2023

Cited by 41

Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology

Yifan Yao, Yingxia Liu, Yuxuan An et al.|Journal of Materials Research and Technology|2023

Cited by 31

Silicon Microelectrodes with Flexible Integrated Cables for Neural Implant Applications

Yifan Yao, K.D. Wise, M.N. Gulari et al.|Unknown|2007

Cited by 25