Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
Yifan Yao(Nankai University), K. N. Tu(City University of Hong Kong), Chih Chen(National Yang Ming Chiao Tung University), Yingxia Liu(City University of Hong Kong), Andriy Gusak(Cherkasy National University)
Cited by 18
Related Papers
TDI charge-coupled devices: Design and applications
|IBM Journal of Research and Development|1992|91
Electromigration in three-dimensional integrated circuits
|Applied Physics Reviews|2023|67
Thermally Resistant, Mechanically Robust, Enamel‐Inspired Hydroxyapatite/Polyethylene Nanocomposite Battery Separator
|Advanced Functional Materials|2023|41
Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
|Journal of Materials Research and Technology|2023|31