Leaderboards/3D IC and TSV technologies

3D IC and TSV technologies

Last updated July 7, 2026

Rising Stars

New and hot

Rising Stars Researchers

1
Debendra Das Sharma
Brihanmumbai Municipal Corporation
2
Tiam Foo Chen
National University of Malaysia
3
Yangyang Lai
Binghamton University
4
Zhong-Jie Hong
National Yang Ming Chiao Tung University
5
Zhiyuan Zhang
Singapore Management University
6
Kai Takeuchi
Tohoku University
7
Sunwu Xu
Suzhou Research Institute
8
Hiroaki Tatsumi
The University of Osaka
9
Hanwen Hu
Dalian Institute of Chemical Physics
10
Hyejun Kang
University of Seoul

Rising Stars Papers

1
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
Nature Electronics|2024
73 cit.
2
Advanced packaging of chiplets for future computing needs
Nature Electronics|2024
38 cit.
3
Atomistic behavior of Cu–Cu solid-state bonding in polycrystalline Cu with high-density boundaries
Materials & Design|2024
22 cit.
4
Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate
Materials & Design|2024
18 cit.
5
The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
Journal of Materials Research and Technology|2024
17 cit.
6
Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$
Scientific Reports|2024
13 cit.
7
A superhydrophobic zirconium‐based metal‐organic framework/cellulose fiber composite material
Polymer Engineering and Science|2024
9 cit.
8
Pharmacokinetic modeling of solid and hollow gold-coated superparamagnetic iron oxide nanoparticles for brain-targeted therapeutics: prediction and experiment
Advanced Composites and Hybrid Materials|2024
9 cit.
9
PCI-Express: Evolution of a Ubiquitous Load-Store Interconnect Over Two Decades and the Path Forward for the Next Two Decades
IEEE Circuits and Systems Magazine|2024
9 cit.
10
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded
IEEE Transactions on Components Packaging and Manufacturing Technology|2024
8 cit.

Emerging Leaders

Gaining momentum

Emerging Leaders Researchers

1
Shuye Zhang
Harbin Institute of Technology
2
Xiongxin Jiang
Nanchang University
3
Chuantong Chen
The University of Osaka
4
Jianhao Wang
Changzhou University
5
Keith Kim
AdventHealth Celebration
6
Homam Naffakh-Moosavy
Tarbiat Modares University
7
Yong-Ho Ko
Korea Institute of Industrial Technology
8
Shin-Puu Jeng
Taiwan Semiconductor Manufacturing Company (Taiwan)
9
Jinli Yan
National University of Defense Technology
10
Sean White
Advanced Micro Devices (Canada)

Emerging Leaders Papers

1
In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects
Journal of Material Science and Technology|2023
138 cit.
2
Challenges and recent prospectives of 3D heterogeneous integration
e-Prime - Advances in Electrical Engineering Electronics and Energy|2022
133 cit.
3
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
International Journal of Mechanical Sciences|2022
125 cit.
4
Molecular level manipulation of charge density for solid-liquid TENG system by proton irradiation
Nano Energy|2022
116 cit.
5
Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution
Materials Characterization|2023
113 cit.
6
Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure
International Journal of Machine Tools and Manufacture|2022
106 cit.
7
Form-stable phase change materials based on graphene-doped PVA aerogel achieving effective solar energy photothermal conversion and storage
Solar Energy|2023
105 cit.
8
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface
Journal of Materials Research and Technology|2023
97 cit.
9
Nano-Ag modified bio-based loofah foam/polyethylene glycol composite phase change materials with higher photo-thermal conversion efficiency and thermal conductivity
Journal of Energy Storage|2022
93 cit.
10
A Novel Room-Temperature Flexible Phase Change Material for Solar Energy Photothermal Conversion and Battery Thermal Management
ACS Sustainable Chemistry & Engineering|2024
87 cit.

Current Senior Leaders

Established & currently active

Current Senior Leaders Researchers

1
Sung Kyu Lim
University of Southern California
2
C. R. Kao
National Taiwan University
3
Tadatomo Suga
Meisei University
4
Seung‐Boo Jung
Sungkyunkwan University
5
Eric Beyne
IMEC
6
K. N. Tu
City University of Hong Kong
7
C.P. Wong
Georgia Institute of Technology
8
Rao Tummala
Georgia Institute of Technology
9
Joungho Kim
Korea Advanced Institute of Science and Technology
10
K. N. Tu
City University of Hong Kong

Current Senior Leaders Papers

1
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Materials Science and Engineering R Reports|2002
1.4k cit.
2
Recent advances on electromigration in very-large-scale-integration of interconnects
Journal of Applied Physics|2003
1.1k cit.
3
Ceramic and Glass‐Ceramic Packaging in the 1990s
Journal of the American Ceramic Society|1991
740 cit.
4
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Materials Science and Engineering R Reports|2006
706 cit.
5
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
Journal of Applied Polymer Science|1999
670 cit.
6
Reliability challenges in 3D IC packaging technology
Microelectronics Reliability|2010
636 cit.
7
Assessing and managing risks using the Supply Chain Risk Management Process (SCRMP)
Supply Chain Management An International Journal|2011
630 cit.
8
Tin–lead (SnPb) solder reaction in flip chip technology
Materials Science and Engineering R Reports|2001
589 cit.
9
Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’
Journal of Applied Physics|1982
568 cit.
10
Microelectronics Packaging Handbook
Journal of Electronic Packaging|1989
535 cit.

Reagents for 3D IC and TSV technologies

Citation-validated products used in this field

🔥 Trending

Gaining adoption fast

⭐ Top Rated

Best all-around

🌟 All-Time

Most validated

Cell Signaling TechnologyEvidence 66

PhosphoPlus® Glycogen Synthase (Ser641) Antibody Duet

Cited in 14 papers
#94905$703
View Evidence →