Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
John H. Lau(ASM Pacific Technology (China)), S. W. Ricky Lee(University of Hong Kong), Rozalia Beica(Dow Chemical (United States)), Koh Sau Wee(Huawei Technologies (China)), Henry Yang, Kai Wu(King University), Eric Ng(ASM Pacific Technology (China)), Iris Xu, Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), Y. H. Chen, Mian Tao(Hong Kong University of Science and Technology), Qingqian Margie Li(ASM Pacific Technology (China)), Zhang Li, Ming Li(ASM Pacific Technology (China)), Nelson Fan(ASM Pacific Technology (China)), Xi Cao(Central South University), Tony Chen(Hospital for Special Surgery), N. C. Lee(Indium Corporation (United States)), Yiu-Ming Cheung(ASM Pacific Technology (China)), C. T. Ko, K. H. Tan, Zhong Cheng(Huawei Technologies (China)), Jeffery C. C. Lo(Hong Kong University of Science and Technology)
IEEE Transactions on Components Packaging and Manufacturing Technology
May 1, 2018
Cited by 96
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