Fan-Out Wafer-Level Packaging for Heterogeneous Integration
John H. Lau(ASM Pacific Technology (China)), S. W. Ricky Lee(University of Hong Kong), Rozalia Beica(Dow Chemical (United States)), Koh Sau Wee(Huawei Technologies (China)), Henry Yang, Margie Li Qingqian(ASM Pacific Technology (China)), Kai Wu(King University), Eric Ng(ASM Pacific Technology (China)), Iris Xu, Penny Lo(ASM Pacific Technology (China)), Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), Mian Tao(Hong Kong University of Science and Technology), Yuhua Chen(Stomatology Hospital), Zhang Li, Ming Li(ASM Pacific Technology (China)), Nelson Fan(ASM Pacific Technology (China)), Xi Cao(Central South University), Tony Chen(Hospital for Special Surgery), N. C. Lee(Indium Corporation (United States)), Yiu-Ming Cheung(ASM Pacific Technology (China)), Cheng-Ta Ko, K. H. Tan, Zhong Cheng(Huawei Technologies (China)), Ji Hao(ASM Pacific Technology (China)), Jeffery C. C. Lo(Hong Kong University of Science and Technology)
IEEE Transactions on Components Packaging and Manufacturing Technology
July 12, 2018
Cited by 87
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