Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
John H. Lau(ASM Pacific Technology (China)), S. W. Ricky Lee(University of Hong Kong), Jeffery C. C. Lo(Hong Kong University of Science and Technology), Rozalia Beica(Dow Chemical (United States)), Koh Sau Wee(Huawei Technologies (China)), Henry Yang, Tom Taylor(Dow Chemical (India)), Kai Wu(King University), Yiu‐ming Cheung(Hong Kong Baptist University), Iris Xu, Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qingxiang Yong(Huawei Technologies (China)), Mian Tao(Hong Kong University of Science and Technology), Margie Li(ASM Pacific Technology (China)), Zhang Li, Ming Li(ASM Pacific Technology (China)), Nelson Fan(ASM Pacific Technology (China)), Xi Cao(Central South University), Tony Chen(Hospital for Special Surgery), K. H. Tan, CT Ko(Micron Corporation (United States)), Ji Hao(ASM Pacific Technology (China)), Lee Nc(Indium Corporation (United States)), Yi‐Hau Chen(Micron Corporation (United States))
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