Failure analysis on MIMCAP failures of 10nm devices using phase angle measurement methodHsu Li khoo, Siew Ming Lim, Lay Lay Goh et al.|Unknown|2022Cited by 3
Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor DevicesChiun Ning Liew, Jiaqi Tang, Wan Nurul Asmak Wan Hasnizam et al.|Unknown|2023Cited by 3
An innovative surrogate chip for accurate high-speed wire bond package measurementHong Shi, Chiun Ning Liew, Siow Chek Tan et al.|Unknown|2010Cited by 1
Investigation of engineering fallout caused by package design marginalityL.L. Goh, Chiun Ning Liew|Unknown|2009Cited by 0
Effective Defect Localization for Scan ATPG Failure through Layout Aware AnalysisJack Yi Jie Ng, Lee Kean Yong, Chia Li Song et al.|Unknown|2022Cited by 0