An innovative surrogate chip for accurate high-speed wire bond package measurement
Hong Shi(Altera (United States)), Chiun Ning Liew(Intel (Malaysia)), W.L. Lee(Hong Kong Polytechnic University), Hoon Ngik Low(Altera (United States)), Chong Poh Lim(Altera (United States)), Siow Chek Tan(Altera (United States)), Swee Fong Chong(Altera (United States)), John Xie(Altera (United States)), Xiaohong Jiang(Future University Hakodate), Loon Kwang Tan(Altera (United States)), P.C. Tan(Altera (United States))
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