Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor Devices

Chiun Ning Liew(Intel (Malaysia)), Jiaqi Tang(J.M. Burgerscentrum), Violeta Prodanović(J.M. Burgerscentrum), Wan Nurul Asmak Wan Hasnizam(Intel (Malaysia))

Unknown

July 24, 2023

10.1109/ipfa58228.2023.10249055

Cited by 3

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