Silicon Microelectrodes with Flexible Integrated Cables for Neural Implant Applications
Yifan Yao(City University of Hong Kong), K.D. Wise(University of Michigan), M.N. Gulari(University of Michigan), B. Casey(University of Michigan), James A. Wiler(University of Michigan)
Cited by 25
Related Papers
TDI charge-coupled devices: Design and applications
|IBM Journal of Research and Development|1992|91
Electromigration in three-dimensional integrated circuits
|Applied Physics Reviews|2023|67
Thermally Resistant, Mechanically Robust, Enamel‐Inspired Hydroxyapatite/Polyethylene Nanocomposite Battery Separator
|Advanced Functional Materials|2023|41
Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
|Journal of Materials Research and Technology|2023|31
Effect of Joule heating on the reliability of microbumps in 3D IC
|Journal of Materials Research and Technology|2024|23