Electromigration in three-dimensional integrated circuits
Zesheng Shen(City University of Hong Kong), Yingxia Liu(City University of Hong Kong), Siyi Jing(City University of Hong Kong), K. N. Tu(City University of Hong Kong), Yiyuan Heng(City University of Hong Kong), Yifan Yao(City University of Hong Kong)
Cited by 67
Related Papers
TDI charge-coupled devices: Design and applications
|IBM Journal of Research and Development|1992|91
Thermomigration induced microstructure and property changes in Sn-58Bi solders
|Materials & Design|2019|58
Thermally Resistant, Mechanically Robust, Enamel‐Inspired Hydroxyapatite/Polyethylene Nanocomposite Battery Separator
|Advanced Functional Materials|2023|41
Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
|Journal of Materials Research and Technology|2023|31