New capability of laser ablation in failure analysisChiun Ning Liew(Intel (Malaysia)), Y.J. Ng(Altera (United States)), L.S. Tiang(Altera (United States)), K L Khoo(Altera (United States))UnknownJuly 1, 201310.1109/ipfa.2013.6599221Cited by 0SaveCiteExport RISWatch citationsRelated PapersFailure analysis on MIMCAP failures of 10nm devices using phase angle measurement method|Unknown|2022|3Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor Devices|Unknown|2023|3An innovative surrogate chip for accurate high-speed wire bond package measurement|Unknown|2010|1Investigation of engineering fallout caused by package design marginality|Unknown|2009|0Effective Defect Localization for Scan ATPG Failure through Layout Aware Analysis|Unknown|2022|0