Low Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging
Yuan-Chiu Huang(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Tzu-Chieh Chou(National Yang Ming Chiao Tung University), Hsin Chi Chang(National Yang Ming Chiao Tung University), Kuma Hsiung(National Yang Ming Chiao Tung University), Ming-Wei Weng(National Yang Ming Chiao Tung University), Demin Liu(Hebei Medical University), Yi-Yu Pan(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University)
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