Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

Scott McCann(Xilinx (United States)), Suresh K. Sitaraman(Georgia Institute of Technology), Yoichiro Sato(Asahi Glass (Japan)), Rao Tummala(Georgia Institute of Technology), Venkatesh Sundaram(Georgia Institute of Technology)
IEEE Transactions on Device and Materials Reliability
December 11, 2015
Cited by 37


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