Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
Xi Liu(Georgia Institute of Technology), Suresh K. Sitaraman(Georgia Institute of Technology), Rao Tummala(Georgia Institute of Technology), Ritwik Chatterjee(Georgia Institute of Technology), Pradeep Dixit(Indian Institute of Technology Bombay), Qiao Chen(Georgia Institute of Technology)
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