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Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)Xi Liu, Suresh K. Sitaraman, Rao Tummala et al.|Unknown|2009Cited by 172
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock testXi Liu, Suresh K. Sitaraman, Rao Tummala et al.|Microelectronics Reliability|2012Cited by 81
Elastic–plastic characterization of thin films using nanoindentation techniqueZhaohui Shan, Suresh K. Sitaraman|Thin Solid Films|2003Cited by 78
Die cracking and reliable die design for flip-chip assembliesS. Michaelides, Suresh K. Sitaraman|IEEE Transactions on Advanced Packaging|1999Cited by 76