Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applicationsZhao-Yun Wang, Shi‐Gang Sun, Lei Jin et al.|Electrochimica Acta|2022Cited by 54
Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board ApplicationLei Jin, Zhong‐Qun Tian, An-Ni Zheng et al.|ACS Sustainable Chemistry & Engineering|2022Cited by 24
1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplatingLei Jin, Dongping Zhan, Zhao-Yun Wang et al.|Journal of Industrial and Engineering Chemistry|2023Cited by 23
Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free fillingJiaqiang Yang, Jiang-Peng Qiu, Lei Jin et al.|Surfaces and Interfaces|2023Cited by 21
A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickeningZhao‐Yun Wang, Lei Jin, Jiaqiang Yang et al.|Journal of Electroanalytical Chemistry|2023Cited by 19