A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
Zhao‐Yun Wang(Xiamen University), Dongping Zhan(Xiamen University), Fang‐Zu Yang(Xiamen University), Lei Jin(Chinese Academy of Sciences), De‐Yin Wu(Xiamen University), Shi‐Gang Sun(Xiamen University), Weiqing Li(Xiamen University), Jiaqiang Yang(Xiamen University)
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