L

Lei Jin

Chinese Academy of Sciences

ORCID: 0009-0007-3829-9449

Publishes on Electrodeposition and Electroless Coatings, Copper Interconnects and Reliability, Semiconductor materials and devices. 135 papers and 1.1k citations.

PubIndex Score14Top 86% · seniorHow it's scored
135Publications
1.1kTotal Citations
First publication: 1990First senior author: 1990