Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling
Jiaqiang Yang(Xiamen University), Zhao‐Yun Wang(Xiamen University), Dongping Zhan(Xiamen University), Yi Zhao(Xiamen University), Fang‐Zu Yang(Xiamen University), Xiaohui Yang(Xiamen University), Lei Jin(Chinese Academy of Sciences), Tao Song(Xiamen University), Jun Cheng(Xiamen University), Jiang-Peng Qiu(Xiamen University)
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