Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling

Jiaqiang Yang(Xiamen University), Zhao‐Yun Wang(Xiamen University), Dongping Zhan(Xiamen University), Yi Zhao(Xiamen University), Fang‐Zu Yang(Xiamen University), Xiaohui Yang(Xiamen University), Lei Jin(Nanchang University), Tao Song(Xiamen University), Jun Cheng(University of Aberdeen), Jiang-Peng Qiu(Xiamen University)
Surfaces and Interfaces
November 30, 2023
Cited by 21


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