Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technologyYifan Yao, Yingxia Liu, Yuxuan An et al.|Journal of Materials Research and Technology|2023Cited by 31
Effect of Joule heating on the reliability of microbumps in 3D ICYifan Yao, Yingxia Liu, Yuxuan An et al.|Journal of Materials Research and Technology|2024Cited by 23
Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder JointsYifan Yao, Yingxia Liu, Zhenyun Lu et al.|Electronic Materials Letters|2024Cited by 7