Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complexLei Jin, Zhong‐Qun Tian, Cheng Liu et al.|Electrochimica Acta|2019Cited by 27
Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board ApplicationLei Jin, Zhong‐Qun Tian, An-Ni Zheng et al.|ACS Sustainable Chemistry & Engineering|2022Cited by 24
1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplatingLei Jin, Dongping Zhan, Zhao-Yun Wang et al.|Journal of Industrial and Engineering Chemistry|2023Cited by 23
A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickeningZhao‐Yun Wang, Lei Jin, Jiaqiang Yang et al.|Journal of Electroanalytical Chemistry|2023Cited by 19
Novel and Green Chemical Compound of HAu(Cys)<sub>2</sub>: Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold ElectrodepositionLei Jin, Zhong‐Qun Tian, De‐Yin Wu et al.|ACS Sustainable Chemistry & Engineering|2020Cited by 14