Constraint Effects on Thin Film Channel Cracking BehaviorTing Y. Tsui, Joost J. Vlassak, Andrew J. McKerrow|Journal of materials research/Pratt's guide to venture capital sources|2005Cited by 55
The effect of water diffusion on the adhesion of organosilicate glass film stacksTing Y. Tsui, Joost J. Vlassak, Andrew J. McKerrow|Journal of the Mechanics and Physics of Solids|2006Cited by 36
Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin FilmsNeil Y. C. Lin, Andrew J. McKerrow, Ting Y. Tsui et al.|MRS Proceedings|2003Cited by 17
The effect of elastic modulus on channel crack propagation in organosilicate glass filmsTing Y. Tsui, Joost J. Vlassak, A. J. Griffin et al.|Thin Solid Films|2006Cited by 11
Subcritical Delamination of Dielectric and Metal Films from Low-k Organosilicate Glass (OSG) Thin Films in Buffered pH SolutionsNeil Y. C. Lin, Andrew J. McKerrow, Ting Y. Tsui et al.|MRS Proceedings|2003Cited by 11