Study on the affecting factors of material removal mechanism and damage behavior of shear rheological polishing of single crystal silicon carbideHongyu Chen, Hua‐Tay Lin, Zhengchao Wu et al.|Journal of Manufacturing Processes|2024Cited by 68
Effect of surface quality on hydrogen/helium irradiation behavior in tungstenHongyu Chen, Yucheng Wu, Laima Luo et al.|Nuclear Engineering and Technology|2021Cited by 58
High-efficiency free-damage electrochemical shear-thickening polishing of single-crystal silicon carbideMingjie Shen, Wei Hang, Lingwei Wu et al.|Journal of Manufacturing Processes|2024Cited by 36
A novel liquid film shearing polishing technique for silicon carbide and its processing damage mechanismsHongyu Chen, Binghai Lyu, Hongbing Wan et al.|Applied Surface Science|2025Cited by 28
Performance of flexible CeO2 composite abrasive in force rheological polishing of fused silica glassMengqing Liu, Guangjian Peng, Jinhu Wang et al.|Journal of Manufacturing Processes|2024Cited by 22