Study on the affecting factors of material removal mechanism and damage behavior of shear rheological polishing of single crystal silicon carbide
Hongyu Chen(Kunming University of Science and Technology), Hua‐Tay Lin(Guangdong University of Technology), Peng Zhang(Chinese Academy of Sciences), Wei Hang(Zhejiang University of Technology), Pengqi Chen(Hefei University of Technology), Binghai Lyu(Zhejiang University of Technology), Heng Chen(Jianghan University), Binbin Hong(Zhejiang University of Technology), Zhengchao Wu(Zhejiang University of Technology), Xingzhong Cao(Chinese Academy of Sciences), Julong Yuan(Zhejiang University of Technology), Qiu Xu(Kyoto University)
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