Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulationPei Chen, Fei Qin, Chenshuo Liu et al.|Modelling and Simulation in Materials Science and Engineering|2019Cited by 36
Generation and distribution of residual stress during nano-grinding of monocrystalline siliconPei Chen, Fei Qin, Tong An et al.|Japanese Journal of Applied Physics|2018Cited by 23
Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulationZhiwei Zhang, Huiping Yu, Pei Chen et al.|AIP Advances|2018Cited by 17
Molecular dynamics simulation on subsurface damage layer during nano grinding process of silicon waferZhiwei Zhang, Fei Qin, Pei Chen|Unknown|2017Cited by 9
Molecular dynamic simulation of grain size and work temperature effect on mechanical properties of polycrystalline copperZhiwei Zhang, Fei Qin, Pei Chen|Unknown|2018Cited by 8