Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element AnalysisVincenzo Vinciguerra, Antonio Landi, Giuseppe Luigi Malgioglio|Composite Structures|2021Cited by 26
From Wafer Bifurcation to Warpage Die: a Correlation Method to determine the Warpage of a Metal-Coated Silicon SubstrateVincenzo Vinciguerra, Marco Renna, Antonio Landi et al.|Unknown|2022Cited by 18
On the Way to understand the Warpage in 8” Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC)Vincenzo Vinciguerra, Antonio Landi|Unknown|2021Cited by 16
Models of Bifurcation in a Semiconductor Wafer: A Comparison of the Analytical Solution vs. the ANSYS Finite Element AnalysisVincenzo Vinciguerra, Antonio Landi, Giuseppe Luigi Malgioglio|Unknown|2022Cited by 12
Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell ElementsVincenzo Vinciguerra, Marco Renna, Antonio Landi et al.|Unknown|2023Cited by 11