From Wafer Bifurcation to Warpage Die: a Correlation Method to determine the Warpage of a Metal-Coated Silicon Substrate
Vincenzo Vinciguerra(STMicroelectronics (Switzerland)), Marco Renna(STMicroelectronics (Switzerland)), Antonio Landi(STMicroelectronics (Italy)), Giuseppe Luigi Malgioglio(STMicroelectronics (Italy)), Brunella Cafra(STMicroelectronics (Italy)), Salvatore Valastro(Institute for Microelectronics and Microsystems)
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